Featured Applications Note:

• AN:001 – Configuring the Vicor BCM with low power niPOLs

  (4 pages, 253k)
  The niPOLs within IBA forego isolation and high–ratio voltage transformation in order to improve cost effectiveness, and they depend upon a nearby bus converter to supply isolated power at a low voltage. The 48 V to 12 V (K = 1/4) BCM can be placed at the power entry point on the board. This will provide safety isolation from the higher 48 V backplane voltage as well as free up board space at the point–of–load.
  
  

• AN:002 – PRM/VTM Parallel Operation

  (4 pages, 44k)
  This applications note describes the steps needed to create a current sharing higher power array using two PRM-AL and VTM pairs in a parallel configuration. If the application requires more than two PRMs in parallel, please contact Applications Engineering for additional information.
  
  

• AN:003 Powering Multiple VTMs with a Single PRM

  (3 pages, 337k)
  This Applications Note discusses the design practices for using Vicor’s V•I Chip Pre-Regulator Module and Voltage Transformation Module to meet the challenge of power systems that require lower voltages, more current, and multiple voltages within one system. Vicor’s V•I Chips can address these challenges.
  
  

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• AN:005 FPA Printed Circuit Board Layout Guidelines

  (10 pages, 522k)
  Factorized Power with V•I Chips enable system density to keep pace with technology by providing layout flexibility and high power density. More importantly, V•I Chips allow a power conversion system to be "factorized" or separated into its constituent functions.
  
  

• AN:006 A Filter Solution for the BCM

  (7 pages, 602k)
  The Bus Converter Module (BCM) is a member of Vicor's Factorized Power Architecture family of V•I Chips. It provides an isolated intermediate bus voltage to power non-isolated point-of-load (POL) converters from a narrow input range DC source.
  
  

• AN:007 Using VTMs as 26 – 55 V Input Bus Converters

  (3 pages, 243k)
  The Voltage Transformation Module (VTM) is a fundamental building block of Factorized Power Architecture (FPA). This new power conversion architecture separates the functions of the DC-DC converter – regulation, isolation, and transformation – into two building blocks.
  
  

• AN:008 V•I Chip Bus Converter Module (BCM) Thermal Management

  (27 pages, 3,834k)
  The purpose of this Applications Note is to determine the power capability of the BCMs given certain ambient temperature and air flow conditions plus heat sink options.
  
  

• AN: 009 V•I Chip Soldering Recommendations

  (4 pages, 261k)
  V•I Chips are intended for reflow soldering assembly. The information contained in this document defines the processing conditions required for successful attachment to a PCB. Failure to follow the recommendations provided can result in aesthetic and functional failure of the module.
  
  

• AN: 016 Using BCM™ Bus Converters in High Power Arrays

  (6 pages, 644k)
  This application note provides methods and guidelines for designing BCMs into high power arrays.
  
  

• AN: 017 RoHS-Compliant Through-Hole V•I Chip Soldering Recommendations

  (9 pages, 556k)
  RoHS compliant, through-hole full size V•I Chips are intended for wave soldering assembly. The information contained in this document defines the processing conditions required for mounting a full size V•I Chip to the PCB using wave soldering or hand soldering.
  
  

• AN: 018 Providing a Constant Current for Powering LEDs using the PRM and VTM

  (21 pages, 2.2MB)
  Light Emitting Diodes (LEDs) require a constant current for proper operation. In order to use the PRM and VTM to power an LED, it is necessary to modify the operation of the PRM to provide a regulated current. This application note provides guidelines for implementing that constant current source using the chipset.
  
  

• AN: 022 MIL EMI and Transient Solutions

  (14 pages, 973k)
  28 Volt defense applications must meet a number of noise and power related standards such as MIL-STD-461, MIL-STD-704, and MIL-STD-1275.
  
  

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